India Widens Semiconductor Ambitions Beyond Assembly and Testing

India is broadening its semiconductor ambitions, moving past chip assembly and testing towards a wider presence across the global value chain. The government is seeking capabilities that span design, fabrication, equipment and materials, according to the country's semiconductor push outlined by Union Minister Ashwini Vaishnaw.

The effort is aimed at chips used in cars, televisions and power infrastructure, marking a shift from a narrower focus on back-end operations. Assembly and testing have so far formed the base of India's semiconductor footprint, but the government now wants to extend into higher-value stages of production.

Building capabilities in design, fabrication, equipment and materials would place India across multiple links of the supply chain rather than at its tail end. The targeted end-use segments — automobiles, consumer electronics such as televisions, and power infrastructure — point to demand from sectors that underpin both industrial activity and everyday consumption.

The stated direction reflects an intent to deepen India's role in semiconductor manufacturing, a sector where global supply chains remain concentrated in a handful of economies. No timelines or specific projects were detailed in the outline of the push.